PECVD

A Plasma Enhanced Chemical Vapor Deposition system for coating up to 6 inch wafers

Photo

Plasma Therm 790

Capabilities

1. Thin film deposition: amorphous silicon (SiH4), nitride (SiH4, NH3), oxide (SiH3, N2O), silicon oxynitride
2. Reaction Gas available: SiH4, NH3, N2O, Maximum power: 400W, Temperature 25~3000C

• SOP (PDF)