Mask Aligner

EVG620 is a dual-use tool designed for optical double-side lithography and precision alignment up to 150 mm wafer sizes. Volume production types and manual R&D systems are available. An ultra-soft wedge compensation together with a computer controlled contact force between the mask and wafer ensures that both yield and mask lifetime are dramatically increased while production costs are lowered. The fully-automated EVG620 utilizes a cassette-to-cassette handling system to efficiently process wafers from 50 mm to 150 mm in diameter, regardless of their shape or thickness. The system safely handles thick, bowed or small diameter wafers. The EVG620 superior alignment stage design achieves highly accurate alignment and exposure results while maintaining high throughput.

Photo

Electronic Vision EVG 620

Capabilities

1. Single and double side alignment with resolution to 1um
2. Wafer available sizes: 4 inch, 5 inch, and 6 inch wafers as well as small pieces
3. Mask available sizes:4, 5, and 6 inch.
4. The following parameters can be changed: exposure time, separation gap of 6-130µm, proximity gap of 6-130µm. Exposure settings can be soft contact, vacuum contact, hard contact or proximity

Operation

• SOP (PDF)
• The available resist processes: Shipley 1813, SU-8 (Microchem), and AZ4620.
• nFab is please to provide the design rule of alignment marks for single and double-side alignment.