Sputter

RF and DC Magnatron sputtering system with a six wafer carousel

Photo

CVC

Capabilities

• RF magnetron and DC magnetron sources
• Substrate heating ability : up to six inch wafers.
• Mass flow control for reactive sputtering using Ar. N2 and O2
• Targets available (8 inch diameter): Al, Al+1%Si, Al+1%Si+4%Cu, Co, Cr, Cu, Mo, MoSi, Nb, Si, SiO2, Ta, Ti, TiW, W

Operation

• SOP (PDF)